TSMC Considers 3D DRAM Production to Support Nvidia
TSMC is evaluating an expansion into advanced 3D DRAM memory chip production following a request from its largest customer, Nvidia.
Taiwan Semiconductor Manufacturing Co (TSMC) is considering entering the advanced memory chip market by producing 3D DRAM. The move aims to increase the company's share of the AI hardware market and comes in direct response to a request from Nvidia, its largest customer.
Hsu Kuo-chin, TSMC's vice president of advanced packaging, is leading the initiative. To implement the expansion, the company is weighing whether to build new factories or acquire and convert an existing plant, a strategy recently used by Micron.
This potential shift occurs during a severe AI-driven shortage of memory chips that has driven up prices and forced chip designers to find new supply sources. If TSMC proceeds, it will compete directly with established memory manufacturers such as Samsung Electronics, SK Hynix, and Micron.
