SQ Advanced Interconnect Plans RM 300 Million IPO

SQ Advanced Interconnect is considering an initial public offering in the first quarter of 2027 to raise approximately RM 300 million. The Malaysian semiconductor firm, which operates in Penang and China, may seek a valuation of up to RM 1.5 billion.

A draft prospectus indicates the company plans to sell about 337.5 million shares. The company intends to use the proceeds for research and development and the expansion of its facilities.

While a company spokesperson declined to comment, sources report that deliberations are ongoing and the final timing and size of the offering remain subject to change. The planned IPO aligns with Malaysia's strategic objective to establish itself as a high-value semiconductor hub during a period of record-high chip exports.