SanDisk and SK hynix Release High Bandwidth Flash Specifications

The Open Compute Project released the first technical specifications for High Bandwidth Flash (HBF) during the Future of Memory and Storage 2026 exhibition in California. Developed over six months by a consortium including SanDisk Corporation, SK hynix Inc., Google, and Tenstorrent, the standards aim to bridge the memory gap between High Bandwidth Memory (HBM) and solid-state drives to accelerate AI inference.

The specification establishes electrical guidelines, system interfaces, and packaging for HBF die stacks. These standards support capacities up to 512 gigabytes and bandwidths reaching 3.0 terabytes per second. The technology employs Universal Chiplet Interconnect Express (UCIe) to integrate with CPUs and GPUs, which is intended to improve throughput for large language models and reduce total cost of ownership.

Alper Ilkbahar, the chief technology officer at SanDisk, stated that the specification provides a practical path for system designers to bring high-capacity memory closer to compute while allowing for more flexible architectures.