TSMC Expands Advanced Packaging Hub in Chiayi Science Park
TSMC will build additional advanced packaging facilities in Taiwan's Chiayi Science Park to meet global demand for high-performance AI chips.
Taiwan Semiconductor Manufacturing Co. is expanding its advanced packaging capacity in the Chiayi Science Park following the start of mass production at two Phase I facilities in June. During a groundbreaking ceremony on July 12, 2026, National Science and Technology Council Minister Wu Cheng-wen announced the start of the park's second phase, which involves the construction of additional facilities to bring the total to four plants.
The 90-hectare site focuses on high-performance computing and chip-on-wafer-on-substrate technology to address the rising demand for artificial intelligence chips. The project aims to integrate Chiayi County into a broader semiconductor and AI industry corridor that includes Tainan, Kaohsiung, Pingtung, and Hsinchu.
Once both phases are fully operational, the industrial cluster is projected to create 9,000 jobs and generate more than NT$300 billion (US$9.35 billion) in annual production value.
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