Intel and 3DGS Invest $3.3 Billion in Odisha Semiconductor Facility

The Government of Odisha, Intel Corporation, and 3D Glass Solutions (3DGS) signed a memorandum of understanding on May 29, 2026, to establish an Advanced Packaging Substrate Manufacturing Facility in Bhubaneswar. The project, signed at Intel's headquarters in Santa Clara, California, involves an estimated investment of $3.3 billion and will be implemented in phases over five to six years.

The facility will utilize advanced glass-based substrate technologies and high-density interconnect packaging to support artificial intelligence, telecommunications, and high-performance computing. Intel will serve as the technology partner, providing licensing, process expertise, and workforce training, while 3DGS provides pioneering glass-core substrate technology. The project is expected to create approximately 1,800 high-skilled direct jobs and includes the development of cleanrooms, fabrication units, and R&D infrastructure at Info Valley.

This initiative is part of the broader US-India TRUST (Transforming relationship utilising strategic technology) Initiative and aligns with the India Semiconductor Mission. It supports India's goal of becoming one of the top six semiconductor nations by 2032 and Odisha's objective to become a $500 billion economy by 2036. The project remains subject to regulatory approvals and funding support from both state and central governments.