Fabric.AI and Kopin Release White Paper on Optical Interconnects

Fabric.AI, Inc. and Kopin Corporation published a joint white paper on August 3, 2026, titled "Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure." The document introduces the Neural I/O platform, which employs MicroLED-based optical interconnect technology to address data movement bottlenecks within AI infrastructure.

Rather than relying on conventional high-speed serial lanes, the proposed technology utilizes a massively parallel architecture of low-power channels. This approach aims for sub-picojoule-per-bit efficiency with a development roadmap targeting an aggregate link bandwidth of 20 terabits per second. The paper provides a framework for investors and engineers to understand the limitations of current copper and laser-based optics in data center environments.

Both companies clarified that the performance figures cited in the paper are based on third-party industry demonstrations and are not measured results of their own specific products. The publication emphasizes a shift away from increasing individual lane speeds toward an architecture built on parallelism to scale AI infrastructure.