China Tightens Semiconductor Design Rules to Protect Chip Tech

The government of China revised regulations protecting integrated-circuit layout designs to safeguard domestic semiconductor intellectual property. Signed by Premier Li Qiang on July 23 and effective October 15, the new rules establish stricter registration standards by requiring applicants to provide declarations of originality and prove genuine creative activity.

These measures aim to filter out low-quality claims and prevent the copying of chip designs. The revisions also expand legal remedies for infringement, granting courts the authority to award punitive damages based on either the infringer's gains or the losses suffered by the rights holder.

Beijing implemented these changes following a series of restrictions by the United States government that limited Chinese access to advanced semiconductor-design software and manufacturing equipment. The new regulations reflect a strategic priority to maintain domestic technological capabilities and prevent the overseas transfer of critical semiconductor technologies.