NXP Semiconductors Expands Assembly Site in Petaling Jaya

NXP Semiconductors broke ground on an expansion of its assembly and test site in Petaling Jaya, Malaysia, adding approximately 500,000 square feet of production space. The project will increase the total site area to 900,000 square feet and is designed as a highly automated smart factory utilizing Automated Material Handling Systems.

The facility is expected to ramp up production in the first quarter of 2028. Once it reaches full capacity, the expansion will more than double the site's current output. This investment supports the company's hybrid manufacturing strategy to diversify its geographic footprint and increase supply chain resilience, complementing existing operations in Thailand and Greater China.

Additionally, the new capacity will support output from NXP's joint ventures located in Germany and Singapore. The groundbreaking ceremony included remarks from Malaysia's Minister of Digital, Gobind Singh Deo, and the Ambassador of the Kingdom of the Netherlands to Malaysia, Jacques Werner.