Xiaomi Unveils Xring O3 Processor to Reduce Chip Reliance

Xiaomi unveiled the Xring O3 on Monday, the latest iteration of its proprietary in-house smartphone processor. The company is developing its own system-on-chips to strengthen its supply chain and reduce its reliance on external chip suppliers such as Qualcomm and MediaTek.

TSMC will manufacture the Xring O3 using 3-nanometre production technology. The chip is intended to power Xiaomi's upcoming flagship folding phone, with the company setting shipment targets between 200,000 and 300,000 units.

This development follows the May 2025 launch of the Xring O1. Xiaomi reported that the O1 has powered over 1 million cumulative devices across tablets, watches, and smartphones, including approximately 150,000 smartphones.