Samsung Electronics Hits 80 Percent Yield for HBM4 Memory

Samsung Electronics reached a nearly 80 percent yield rate for its HBM4 memory, a milestone known in the industry as the Golden Yield. This represents a significant increase from the 60 percent yield recorded at the start of mass production in February 2026.

The HBM4 solution utilizes 12-Hi stacks with capacities up to 36 GB and bandwidth reaching 3.3 TB/s. Following this technical achievement, the company tripled its projected third-quarter revenue for HBM4 DRAM and expects to grow its market share by more than 60 percent during the second half of 2026.

AMD has already integrated the HBM4 memory into its Instinct MI400 platform. To further challenge the market dominance of SK Hynix, Samsung is developing HBM4e, which has currently reached a 70 percent reliability test yield. The company is pursuing contracts with Nvidia for the Rubin Ultra platform and AMD for the MI500 series.