Micron Invests $100 Billion in U.S. Semiconductor Fabs
Micron Technology is building four new semiconductor facilities in Idaho and New York to meet AI demand amid growing political opposition to data centers.
Micron Technology is investing $100 billion to expand its U.S. manufacturing capacity by constructing four semiconductor fabs. The project includes two facilities in Boise, Idaho, and two in Clay, New York, designed to produce dynamic random access memory (DRAM) for AI data centers.
CEO Sanjay Mehrotra initiated the expansion to ensure the company does not become a bottleneck in the AI build-out. The investment is supported by $6 billion in funding from the federal government through the CHIPS and Science Act.
While Micron expands, the broader data center industry faces increasing political resistance. Governors Greg Abbott of Texas and Josh Shapiro of Pennsylvania have shifted from supporting these projects to criticizing them. Governor Abbott stated that the industry "basically dug their own grave for the problem that’s been caused for them, and that’s why they got the backlash they deserve," reflecting a negative trend in political sentiment toward data centers that began in early 2025.