AMD and Schneider Electric Launch AI Factory Reference Design

AMD and Schneider Electric announced a jointly developed reference design for the AMD Helios rackscale solution on July 23, 2026. The co-engineered blueprint is designed to accelerate the deployment of high-density AI factories by reducing integration risk and complexity for customers.

The hardware architecture utilizes AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, and AMD Pensando Vulcano NICs, all operating within the ROCm software ecosystem. To address extreme thermal requirements, the design integrates advanced liquid cooling via Motivair by Schneider Electric, which is capable of removing 84% of heat. The system supports AI racks of up to 246 kW and modular clusters with an IT load reaching 10.4 MW.

Currently, the framework is validated to ANSI standards for use in the United States, though the companies plan to extend support to IEC standards for global implementation. Executives from both firms emphasized that integrating compute, networking, power, and cooling from the start is essential as AI infrastructure shifts toward full-scale factory models.