TSMC Accelerates 1.4nm Chip Production to 2028
TSMC is moving up mass production of its 1.4nm process to 2028 and developing advanced packaging technology to compete with Intel and Samsung.
Taiwan Semiconductor Manufacturing Co. is accelerating its semiconductor roadmap by moving the mass production of its 1.4-nanometer process forward to 2028. To support this timeline, the company is constructing a production plant in Taichung Science Park, with completion expected around April 2027 and trial production scheduled for the third quarter of that year.
Beyond the 1.4nm process, TSMC is partnering with Kinsus Interconnect Technology to develop an advanced chip packaging technology, internally dubbed EMIB Like. This initiative is designed to challenge the Embedded Multi-die Interconnect Bridge technology developed by Intel Corp.
This acceleration puts TSMC ahead of Samsung Electronics, which recently pushed its own 1.4nm mass production target back to 2029 to optimize yields. Meanwhile, Nvidia Corp. is reportedly evaluating Intel's EMIB packaging for a future processor, and Intel has partnered with Lens Technology to develop glass substrate-based packaging.
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