Infineon and Wolfspeed Sign 200mm Silicon Carbide Supply Deal

Infineon Technologies AG signed a multi-year agreement with Wolfspeed to secure a supply of 200mm silicon carbide wafers. The deal transitions the existing supply relationship between the two companies from 150mm to 200mm substrates to support a broader manufacturing conversion.

The shift to larger wafers aims to increase manufacturing efficiency by providing more usable die area and lowering the substrate cost per unit. Infineon will utilize these substrates across its global network, including a 200mm silicon carbide fabrication plant in Kulim, Malaysia.

The company is targeting demand from AI datacenters, solar inverters, industrial motor drives, and electric vehicle drivetrains, where silicon carbide offers superior thermal performance and switching efficiency compared to traditional silicon. Neither company disclosed the specific volumes or the financial value of the agreement.