Intel and Applied Materials Partner to Accelerate AI Chipmaking

Intel Corporation and Applied Materials, Inc. have entered a collaboration to accelerate the development of semiconductor innovations specifically designed for AI-driven computing. The partnership targets breakthroughs in next-generation transistors, interconnects, and advanced packaging technologies, with a particular focus on Foveros-based 3D stacking to enhance thermal performance and power delivery for agentic AI workloads.

The initiative integrates resources from Intel's research and development campus in Hillsboro, Oregon, and the new Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley. Scheduled to be operationally ready in 2026, the EPIC Center is designed to shorten development cycles and reduce the time required to transition semiconductor technologies from early-stage research to high-volume manufacturing within the United States.