Samsung and Broadcom Ink $200 Billion AI Infrastructure Deal

Two major semiconductor partnerships emerged in late July 2026 to address the scaling needs of AI infrastructure. Samsung Electronics and Broadcom signed a memorandum of understanding at an AI summit in San Francisco to expand strategic collaboration across memory, foundry, and advanced packaging technologies. Estimated at more than $200 billion through 2030, the deal involves Samsung supplying high-bandwidth memory for Broadcom AI accelerators and utilizing 2nm and below process technologies for wireless broadband solutions. This agreement allows Broadcom to diversify its supply chain away from TSMC and helps Samsung increase its foundry market share.

Simultaneously, Nvidia and SK Hynix entered the largest memory deal in history to secure high-bandwidth memory supply and co-develop future AI memory generations. To support this partnership, SK Hynix subsidiary SK Telecom will construct a 2-gigawatt AI cloud data center in South Korea using Nvidia's Vera Rubin Platform. This arrangement aims to resolve HBM capacity constraints and improve power efficiency for GPUs as Nvidia expands further into the inference market.