TSMC to Raise Chipmaking Prices by 10% in 2027

Taiwan Semiconductor Manufacturing Company plans to increase chipmaking prices by 5% to 10% beginning in 2027. The price hikes will apply to advanced node production under 6-nm as well as mature nodes, including 12-nanometre, 16-nm, and 28-nm technologies. For 3nm wafers, costs could rise from approximately $19,500 to $21,450 depending on the customer and specific chip.

The company aims to offset rising costs for raw materials, manufacturing equipment, and the construction of overseas fabrication plants. Negotiations for the new pricing structure took place between June and July 2026. A company spokesperson described the pricing approach as "strategic, not opportunistic."

CEO C.C. Wei previously indicated that prices could climb due to sustained demand for AI chips, though he stated the company would avoid the abrupt, massive hikes typically seen among memory manufacturers. The move may increase production costs for major clients such as Apple Inc., Qualcomm Inc., and NVIDIA, potentially leading to higher consumer prices for electronics. These clients may respond by seeking alternative suppliers, including Intel or Samsung Electronics, the latter of which provides a competing 2nm process.