Samsung Invests 6 Trillion Won in South Korean Chip Plant

Samsung Electronics is investing 6 trillion won ($4.48 billion) to build a high-bandwidth memory (HBM) chip packaging plant in Asan. The facility will feature three floors of clean-room space totaling approximately 31,000 square metres. To address increasing demand for server memory, the company accelerated its original timeline by one year and now plans to begin operations in June 2028.

President Lee Jae Myung announced at a groundbreaking ceremony on November 12 that the project will trigger an estimated 40 trillion won in additional investment for advanced equipment. Lee linked the expansion to government mega projects focused on semiconductors, physical artificial intelligence, and AI data centers.